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Full Automatic Lead-Free Reflow Soldering Machine

Full Automatic Lead-Free Reflow Soldering Machine

Update Terakhir 18 / 12 / 2022
Minimal Pembelian 1 Unit

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Detail Full Automatic Lead-Free Reflow Soldering Machine

Testing Instrument

Heating area number: up six/down six;
Completing precision welding of QFP, CSP, Chip and BGA such devices;
Heating area length: 1800mm;
Control mode: PID intelligent control;
Heating mode: independent minor cycle all hot air;
Cooling zone number: forced air cooling;
PCB width: net belt type 300mm;
Transport direction: L-R,L-R;
Transmit height: net belt 880±20mm;
Power supply : AC 3phase 380V 50Hz;
Start power: 18KW;
Normal work power consumption: Approx.5KW;
Warming time: 15min;
Temperature control scope: room temperature -400°C;
Control mode: PID + SSR driver (or PLC + computer control);
Temperature control precision: ± 1°C;PCB temperature distribution deviation: ±2°C;
Weight: about 550kg;
Overall dimension: about L 3150×W700×H 1400mm.